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100kW Rack-Type CDU Delivered to Indonesia for Data Center Cooling

Aug 13, 2026

Project Overview

As AI computing, high-performance computing, and other high-density workloads continue to develop, data centers are facing increasing challenges in managing server heat loads. Compared with traditional air cooling, liquid cooling can provide more efficient heat removal for high-density computing environments. The delivered CDU is designed to support this transition by providing controlled and reliable coolant circulation at the rack level.

 

Project Information

· Country: Indonesia

· Application: Data Center

· Product: Rack-Type CDU

· Cooling Capacity: 100 kW

· CDU Type: Liquid-to-Liquid CDU

· Manifold: 10-Port Manifold

 

 

 

Project Features

The liquid-to-liquid CDU is designed to transfer heat between the primary facility cooling loop and the secondary cooling loop serving liquid-cooled IT equipment. By separating the two cooling circuits, the CDU helps provide stable coolant management while reducing the direct impact of changes in the facility-side cooling system on the IT equipment side.

The accompanying 10-port manifold enables coolant to be distributed to multiple cooling circuits or liquid-cooled racks from a centralized point. This configuration supports organized piping connections and provides greater flexibility for rack-level liquid cooling deployment.

The compact rack-type configuration also makes the CDU suitable for high-density data center environments where equipment space and cooling efficiency are important considerations.

 

Project Significance

This delivery represents another step in IMMERSION ENERGY's expansion of advanced data center cooling solutions in Southeast Asia. Indonesia is experiencing continued growth in digital infrastructure and data center development, creating increasing demand for reliable and energy-efficient cooling technologies.

By providing a 100kW rack-type CDU , IMMERSION ENERGY supports data center operators in adopting liquid cooling for high-density computing applications. The solution can help establish a more efficient cooling architecture while providing the flexibility required for future rack-level expansion.

 

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